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january 2011 doc id 7480 rev 4 1/11 11 x02 1.25 a sensitive gate scr features on-state rms current: 1.25 a repetitive peak off-state voltage: 600 v and 800 v gate triggering current: 50 and 200 a applications ground fault circuit interrupters overvoltage crowbar protection in power supplies capacitive ignition circuits description the x02 scr can be used as the on/off function in applications where topology does not offer high current for gate triggering. this device is optimized in forward voltage drop and inrush current capab ilities for reduced power losses and high reliabilit y in harsh environments. a k g a a k g a k g a k g sot-223 x02xxn to-92 x02xxa smbflat-3l X0202NUF table 1. device summary order code voltag e sensitivity a package 600 v 800 v x0202ma y 200 to-92 x0202mn y 200 sot-223 x0202na y 200 to-92 x0202nn y 200 sot-223 x0205ma y 50 to-92 x0205na y 50 to-92 X0202NUF y 200 smbflat-3l www.st.com
characteristics x02 2/11 doc id 7480 rev 4 1 characteristics table 2. absolute ratings (limiting values, t j = 25 c unless otherwise specified) symbol parameter value unit i t(rms) on-state rms current (180 conduction angle) to-92 t l = 63 c 1.25 a sot-223 t tab = 99 c smbflat-3l t tab = 111 c it (av) average on-state current (180 conduction angle) to-92 t l = 63 c 0.8 a sot-223 t tab = 99 c smbflat-3l t tab = 111 c i tsm non repetitive surge peak on-state current t p = 8.3 ms t j = 25 c 25 a t p = 10 ms 22.5 i 2 ti 2 t value for fusing t p = 10 ms t j = 25 c 2.5 a 2 s di/dt critical rate of rise of on-state current i g = 2 x i gt , t r 100 ns f = 60 hz t j = 125 c 50 a/s i gm peak gate current t p = 20 s t j = 125 c 1.2 a p g(av) average gate power dissipation t j = 125 c 0.2 w t stg t j storage junction temperature range operating junction temperature range - 40 to + 150 - 40 to + 125 c table 3. electrical characteristics (t j = 25 c unless otherwise specified) symbol test conditions x0202 x0205 unit i gt v d = 12 v, r l = 140 min. 20 a max. 200 50 v gt max. 0.8 v v gd v d = v drm, r l = 3.3 k , r gk = 1 k t j = 125 c min. 0.1 v v rg i rg = 10 a min. 8 v i h i t = 50 ma, r gk = 1 k max. 5 ma i l i g = 1 ma, r gk = 1 k max. 6 ma dv/dt v d = 67% v drm, r gk = 1 k t j = 110 c min. 10 15 v/s table 4. static electrical characteristics symbol test conditions x0202 x0205 unit v tm i tm = 2.5 a, t p = 380 s t j = 25 c max. 1.45 v v to threshold voltage t j = 125 c 0.9 v r d dynamic resistance 200 m i drm i rrm v drm = v rrm, r gk = 1 k t j = 25 c 5 a t j = 125 c 500 a
x02 characteristics doc id 7480 rev 4 3/11 table 5. thermal resistances symbol parameter value unit r th(j-l) junction to leads (dc) to-92 max. 60 c/w r th(j-t) junction to tab (dc) sot-223 25 r th(j-t) junction to tab (dc) smbflat-3l 14 r th(j-a) junction to ambient (dc) to-92 150 s = 5 cm 2 sot-223 60 smbflat-3l 75 figure 1. maximum average power dissipation versus average on-state current (full cycle) figure 2. average and dc on-state current versus tab (sot-223, smbflat-3l) or lead (to-92) temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 p(w) = 180 i (a) t(av) 360 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 25 50 75 100 125 d.c. (smbflat-3l) d.c. (to-92) d.c. (sot-223) = 180 (smbflat-3l) = 180 (sot-223) = 180 (to-92) t or t (c) lead tab i (a) t(av) figure 3. average and dc on-state current versus ambient temperature figure 4. relative variation of thermal impedance junction to ambient versus pulse duration 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 25 50 75 100 125 i (a) t(av) d.c. (smbflat-3l) d.c. (to-92) d.c. (sot-223) = 180 (smbflat-3l) = 180 (sot-223) = 180 (to-92) t (c) amb k=[z /r th(j-a) th(j-a) ] 0.01 0.10 1.00 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 to-92 sot-223 t (s) p smbflat-3l
characteristics x02 4/11 doc id 7480 rev 4 figure 5. relative variation of triggering, holding and latching current versus junction temperature figure 6. relative variation of holding current versus gate-cathode resistance (typical values) i,i,i[t] / gt h l j i ,i ,i [t =25c] gt h l j 0.00 0.25 0.50 0.75 1.00 1.25 1.50 -40 -20 0 20 40 60 80 100 120 140 i gt t (c) j i h & i r = 1k l gk typical values i [r ] / i [ =1k ] hgk h r gk 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1.e-02 1.e-01 1.e+00 1.e+01 tj=25 r(k) gk figure 7. relative variation of dv/dt immunity versus gate-cathode resistance (typical values) figure 8. relative variation of dv/dt immunity versus gate-cathode capacitance (typical values) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10.0 dv/dt[r ] / dv/dt[ =1k ] gk r gk t j = 125c v = 0.67 x v d drm r(k) gk 20 18 16 14 12 10 8 6 4 2 0 0 24 6810 12 14 16 18 20 22 c (nf) gk dv/dt[c ] / dv/dt[ =1k ] gk r gk t v = 0.67 x v = 125c r = 1k d drm gk j figure 9. surge peak on-state current versus number of cycles figure 10. non repetitive surge peak on state current for a sinusoidal pulse and corresponding value of i 2 t 1 10 100 1000 0 5 10 15 20 25 i (a) tsm number of cycles non repetitive t initial=25c j repetitive t =25c amb t =10ms p one cycle 1.00 10.00 0.10 0.01 300 100 10 1 i (a), i t (a s) tsm 22 t initial = 25c j i t 2 i tsm t (ms) p di/dt limitation
x02 ordering information scheme doc id 7480 rev 4 5/11 2 ordering information scheme figure 13. ordering information scheme figure 11. on-state characteristics (maximum values) figure 12. thermal resistance junction to ambient versus copper surface under tab (sot-223, smbflat-3l) i (a) tm 3e+1 1e+1 1e+0 1e-1 2.0 2.5 3.0 3.5 4.0 4.5 1.5 1.0 0.5 t j =max t =25c j v (v) tm v =0.9v r =200m t max.: j t0 d r (c/w) th(j-a) 50 60 70 80 90 100 110 120 130 140 150 160 170 012345 smbf3l (typical) sot-223 (maximum) s(cm2) epoxy printed circuit board fr4, copper thickness 35 m x 02 02 m z blank 1ba2 sensitive scr series sensitivity voltage package packing mode current 02 = 1.25 a 2bl2 = ammopack 5ba4 = tape and reel 7? (sot-223) blank = tape and reel 13? (smbflat-3l) 02 = 200 a 05 = 50 a m = 600 v n = 800 v a = to-92 (a"blank") n = sot-223 (n"no blank?) uf = smbf3l 1ba2 = bulk
package information x02 6/11 doc id 7480 rev 4 3 package information epoxy meets ul94, v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 6. to-92 dimensions ref dimensions millimeters inches min. typ. max. min. typ. max. a1.35 0.053 b 4.70 0.185 c2.54 0.100 d 4.40 0.173 e 12.70 0.500 f 3.70 0.146 a 0.50 0.019 a f c b a de
x02 package information doc id 7480 rev 4 7/11 figure 14. sot-223 footprint table 7. sot-223 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a1.800.071 a1 0.02 0.10 0.001 0.004 b 0.60 0.70 0.85 0.024 0.027 0.033 b1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 d (1) 1. do not include mold flash or protrusions. mold flas h or protrusions shall not exceed 0.15mm (0.006inches) 6.30 6.50 6.70 0.248 0.256 0.264 e 2.3 0.090 e1 4.6 0.181 e (1) 3.30 3.50 3.70 0.130 0.138 0.146 h 6.70 7.00 7.30 0.264 0.276 0.287 v 10 max a a1 e1 d b1 h e e 12 4 3 b v c 3.25 1.32 7.80 5.16 1.32 2.30 0.95
package information x02 8/11 doc id 7480 rev 4 figure 15. smbflat-3l footprint dimensions table 8. smbflat-3l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 0.35 0.65 0.014 0.026 b4 1.95 2.20 0.07 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 l1 0.40 0.016 l2 0.60 0.024 e 1.60 0.063 d a l 2x l l2 l1 l1 l2 2x e e1 b4 c e b 2x millimeters (inches) 1.20 (0.047) 2.07 (0.082) 0.51 (0.020) 0.51 (0.020) 1.20 (0.047) 3.44 (0.136) 5.84 (0.230) 2.07 (0.082)
x02 package information doc id 7480 rev 4 9/11 figure 16. footprint and connectors for sot-223 or smbflat-3l (dimensions in mm) sot-223 sot-223 sot-223 sot-223 smbf3l smbf3l smbf3l 3.42 1.50 3.25 1.32 2.92 1.19 1.32 0.95 7.80 2.30 1.10 0.85 2.07 1.20 0.51 1.20 1.95 2.22 1.08 1.35 1.08 1.30 0.46 0.61 1.19 1.47 5.84 2.07 solder resist solder lands solder paste connector line
ordering information x02 10/11 doc id 7480 rev 4 4 ordering information 5 revision history table 9. ordering information order code marking package weight base qty delivery mode x0202ma 1ba2 x0202 ma to-92 0.2 g 2500 bulk x0202ma 2bl2 x0202 ma to-92 0.2 g 2000 ammopack x0202mn5ba4 x2m sot-223 0.12 g 1000 tape and reel x0202na 1ba2 x0202 na to-92 0.2 g 2500 bulk x0202na 2bl2 x0202 na to-92 0.2 g 2000 ammopack x0202nn5ba4 x2n sot-223 0.12 g 1000 tape and reel x0205ma 1ba2 x0205 ma to-92 0.2 g 2500 bulk x0205ma 2bl2 x0205 ma to-92 0.2 g 2000 ammopack x0205na 1ba2 x0205 na to-92 0.2 g 2500 bulk X0202NUF x2n smbflat-3l 46.914 mg 5000 tape and reel table 10. document revision history date revision changes sep-2000 3 previous issue 14-jan-2011 4 added smbflat-3l package and ecopack statement.
x02 doc id 7480 rev 4 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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